One month ago, Intel has launched its third-generation Xeon Scalable CPU family named Cooper Lake, which is based on 14nm architecture. Recently, some users in mainland China have purchased the first QS Copper Lake chips, which have shown an exciting design of the Cedar Island platform when comparing it with the family of already existing CPUs.
One user revealed on Bilibili that the particular Cooper Lake-SP qualification sample is Intel’s Xeon Gold CPU. The person who leaked this information also shared that the CPU featured 20 cores, 40 threads which are based on the 14nm architecture, plus that the CPU comes with a base clock of 2.2 GHz.
Plus, it seems that Intel’s Xeon Gold Copper Lake CPU was produced last year in 2019, sometime around the beginning of August. Thus, the CPU was out almost a year prior to it was officially launched.
Intel’s Xeon Gold CPU specs
According to the official reveals from Intel, the specs of the Xeon Gold CPU include a base clock of 2.4 GHz and a boost clock of 4.3 GHz. Now, you may have noticed the difference, but that happened because the chip itself was produced before the official specifications were finalized for the Cooper Lake-SP line.
But make no mistake, this isn’t the only difference we are seeing on the chip when we compare it with its final retail form.
When you take a look at the IHS, there’s also an undeniable resemblance to the older Cooper Lake version, the CPX-4, than the CPX-6 version, which was officially launched one month ago.
All chips from the Cooper Lake lineup were designed initially for both Cedar Island and Whitley platforms. However, the Whitley version, the CPX-4 version, was later canned. Users were expecting for the chip to offer up to 56 cores plus 112 threads, but it looks like Intel has changed its plans and will only be launched its 10nm Ice Lake-SP CPUs for the Whitley platform. However, Intel is going to make a huge update within the Xeon landscape since the official launch of Skylake-SP five years ago, back in 2015.
Intel’s Xeon Gold CPU was also delidded, revealing that it has a dual-package design, which we wouldn’t necessarily think of as spectacular as it is a rather common design used by Intel over the last few years.
However, what it is truly interesting are the materials used to beneath the IHS, which reveal a soldered design with gold solder and great quality liquid metal thermal compound. However, it is difficult to say whether or not the retail versions will also feature gold solder like the qualification chip.
Another interesting detail is that the CPU also doesn’t share the same socket key as the official Copper Lake-SP version, but it is somewhat more similar to the Whitley platform’s socket key. This confirms that the CPU is one of the many abandoned Cooper Lake-SP parts.